Patent Assignment
Reel/Frame 044049/0046
Assignment of Assignor's Interest
Recorded: 2017-09-28
Pages: 4
Assignors
TSOU, HSIEN-JU
Executed: 2017-09-15
WU, CHIH-WEI
Executed: 2017-09-15
WANG, PU
Executed: 2017-09-18
SHIH, YING-CHING
Executed: 2017-09-15
LU, SZU-WEI
Executed: 2017-09-18
LIN, JING-CHENG
Executed: 2017-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package, Method for Forming Semiconductor Package, and Method for Forming Semiconductor Assembly