Patent Assignment
Reel/Frame 044077/0416
Assignment of Assignor's Interest
Recorded: 2017-11-09
Pages: 5
Assignors
TSENG, YING-CHENG
Executed: 2017-10-20
CHEN, CHIH-HUA
Executed: 2017-10-20
LIN, HSIU-JEN
Executed: 2017-10-20
TSAI, HAO-YI
Executed: 2017-10-20
YEE, KUO-CHUNG
Executed: 2017-10-30
LIU, CHIA-HUNG
Executed: 2017-10-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same
Patent:
10,074,615 →
Application:
15/794,003 →