Patent Assignment
Reel/Frame 044079/0706
Assignment of Assignor's Interest
Recorded: 2017-11-09
Pages: 4
Assignors
CHENG, CHUNG-HSIU
Executed: 2017-10-13
CHOU, YOUNG-SHUEN
Executed: 2017-10-13
CHIU, I-CHE
Executed: 2017-10-13
LU, TSUNG-HAO
Executed: 2017-10-13
LIAO, KEN
Executed: 2017-10-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method and Apparatus for Wafer Backside Cooling