Patent Assignment
Reel/Frame 044096/0416
Assignment of Assignor's Interest
Recorded: 2017-11-10
Pages: 6
Assignors
LEE, CHANG SUP
Executed: 2017-06-28
NAM, PHIL OUK
Executed: 2017-06-28
LEE, SUNG YUN
Executed: 2017-06-28
KANG, CHANG SEOK
Executed: 2017-06-28
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three Dimensional Semiconductor Device and Method of Forming the Same