Patent Assignment
Reel/Frame 044110/0415
Assignment of Assignor's Interest
Recorded: 2017-11-13
Pages: 3
Assignor
YAMAUCHI, AKIRA
Executed: 2016-10-14
Assignees
SUGA, TADATOMO
3-6-3, HIGASHINAKANO, NAKANO-KU, TOKYO, 164-0003, JAPAN
BONDTECH CO., LTD.
77, ISHIHARANISHIMACHI, KISSHOIN, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8366, JAPAN
Covered Property
(1)
Substrate Bonding Apparatus and Substrate Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.