IP Library › Assignment 070480/0646
Patent Assignment
Reel/Frame 070480/0646

Change of Address

Recorded: 2025-03-11 Pages: 3
Assignor
BONDTECH CO., LTD.
Executed: 2025-01-09
Assignee
BONDTECH CO., LTD.
25, MIYANOHIGASHI-CHO, KISSHOIN, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8305, JAPAN
Covered Properties (2)
Substrate Bonding Apparatus and Substrate Bonding Method
Patent: 9,870,922 →
Application: 15/306,303 →
Publication: US 2017/0047225
Substrate Bonding Apparatus and Substrate Bonding Method
Application: 15/810,932 →
Publication: US 2018/0068854
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 24, 2016
From: YAMAUCHI, AKIRA
To: SUGA, TADATOMO; BONDTECH CO., LTD.
Reel/Frame 040103/0899 →
Assignment of Assignor's Interest Nov 13, 2017
From: YAMAUCHI, AKIRA
To: SUGA, TADATOMO; BONDTECH CO., LTD.
Reel/Frame 044110/0415 →