Assignment of Assignor's Interest

Recorded: 2016-10-24 Pages: 3

Assignor

YAMAUCHI, AKIRA

Executed: 2016-10-14

Assignees

SUGA, TADATOMO

3-6-3, HIGASHINAKANO, NAKANO-KU, TOKYO, 164-0003, JAPAN

BONDTECH CO., LTD.

77, ISHIHARANISHIMACHI, KISSHOIN, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8366, JAPAN

Covered Property (1)

Substrate Bonding Apparatus and Substrate Bonding Method

Patent: 9,870,922 →

Application: 15/306,303 →

Publication: US 2017/0047225

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.