Patent Assignment
Reel/Frame 044112/0325
Assignment of Assignor's Interest
Recorded: 2017-11-13
Pages: 2
Assignors
MOLLA, JAYNAL A.
Executed: 2017-11-07
VISWANATHAN, LAKSHMINARAYAN
Executed: 2017-11-07
TUCKER, GEOFFREY
Executed: 2017-11-07
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property
(1)
Microelectronic Systems Containing Embedded Heat Dissipation Structures and Methods for the Fabrication Thereof
Patent:
10,141,182 →
Application:
15/811,298 →