Patent Assignment
Reel/Frame 044112/0364
Assignment of Assignor's Interest
Recorded: 2017-11-13
Pages: 4
Assignor
KAWAZU, YOSHIKI
Executed: 2017-10-31
Assignee
KYOCERA CORPORATION
6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO-SHI, KYOTO, 612-8501, JAPAN
Covered Property
(1)
Semiconductor Element Package, Semiconductor Device, and Mounting Structure