IP Library › Assignment 044114/0453
Patent Assignment
Reel/Frame 044114/0453

Assignment of Assignor's Interest

Recorded: 2017-11-14 Pages: 6
Assignors
LIN, WEI
Executed: 2014-04-30
SKORDAS, SPYRIDON
Executed: 2014-04-28
YOUNG, ROBERT R., JR.
Executed: 2014-04-29
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Gas-Controlled Bonding Platform for Edge Defect Reduction During Wafer Bonding
Application: 15/811,738 →
Publication: US 2018/0082863
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 4, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052561/0161 →