Patent Assignment
Reel/Frame 044176/0054
Assignment of Assignor's Interest
Recorded: 2017-11-20
Pages: 4
Assignors
TAKEZAWA, YOSHITAKA
Executed: 2017-10-30
TANAKA, SHINGO
Executed: 2017-11-01
HOJO, FUSAO
Executed: 2017-11-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Epoxy Resin Composition, Thermally-Conductive Material Precursor, B-Stage Sheet, Prepreg, Heat Dissipation Material, Laminate, Metal Substrate, and Printed Circuit Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →