IP Library › Assignment 044177/0675
Patent Assignment
Reel/Frame 044177/0675

Assignment of Assignor's Interest

Recorded: 2017-11-20 Pages: 4
Assignors
ZHU, JI GUANG
Executed: 2017-11-10
LI, HAI TING
Executed: 2017-11-10
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
18 WEN CHANG ROAD, ECONOMICAL-TECHNOLOGICAL, DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100176, CHINA
Covered Property (1)
Method of Forming Interconnect Structure with Partial Copper Plating
Application: 15/816,973 →
Publication: US 2018/0151426
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2018
From: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION; NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Reel/Frame 045711/0734 →