Patent Assignment
Reel/Frame 044188/0103
Assignment of Assignor's Interest
Recorded: 2017-11-21
Pages: 3
Assignors
BERNSTEIN, KERRY
Executed: 2013-09-30
BRUNSCHWILER, THOMAS
Executed: 2013-09-18
MICHEL, BRUNO
Executed: 2013-09-18
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Assembly Including Plural Through Wafer Vias, Method of Cooling the Assembly and Method of Fabricating the Assembly