Patent Assignment
Reel/Frame 044191/0736
Assignment of Assignor's Interest
Recorded: 2017-11-21
Pages: 5
Assignors
LEE, JI HYUN
Executed: 2017-11-02
KIM, JIN GU
Executed: 2017-11-02
LEE, CHANG BAE
Executed: 2017-11-02
KIM, JIN SU
Executed: 2017-11-02
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.