Patent Assignment
Reel/Frame 044194/0522
Assignment of Assignor's Interest
Recorded: 2017-11-21
Pages: 5
Assignor
MICRO PROCESSING TECHNOLOGY, INC.
Executed: 2017-11-20
Assignees
MICRO PROCESSING TECHNOLOGY, INC.
3446 GOLDEN GATE WAY, LAFAYETTE, CALIFORNIA, 94549
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Method of Removing Back Metal from an Etched Semiconductor Scribe Street
Patent:
8,450,188 →
Application:
13/136,459 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 21, 2017
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044194/0577 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →