Patent Assignment
Reel/Frame 044194/0699
Assignment of Assignor's Interest
Recorded: 2017-11-21
Pages: 3
Assignor
GRIVNA, GORDON M.
Executed: 2017-11-20
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
System for Separating Devices from a Semiconductor Wafer
Patent:
9,153,493 →
Application:
13/742,562 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 16, 2013
From: LINDSEY, PAUL C., JR.
To: MICRO PROCESSING TECHNOLOGY, INC.
Reel/Frame 029638/0436 →
Assignment of Assignor's Interest
Nov 21, 2017
From: MICRO PROCESSING TECHNOLOGY, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044194/0685 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →