Patent Assignment
Reel/Frame 044196/0646
Assignment of Assignor's Interest
Recorded: 2017-11-22
Pages: 5
Assignors
NAM, PHIL OUK
Executed: 2017-09-26
AHN, JAEYOUNG
Executed: 2017-09-26
LEE, SANGSOO
Executed: 2017-09-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Device and Method of Fabricating the Same