Patent Assignment
Reel/Frame 044201/0770
Assignment of Assignor's Interest
Recorded: 2017-11-22
Pages: 4
Assignor
LEE, DONG-HA
Executed: 2017-10-20
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package