Patent Assignment
Reel/Frame 044224/0561
Assignment of Assignor's Interest
Recorded: 2017-11-27
Pages: 7
Assignors
OTSUKA, YOSHITAKA
Executed: 2017-11-07
NAKAMITSU, TAKASHI
Executed: 2017-11-07
OMORI, YOSUKE
Executed: 2017-11-07
SUGAKAWA, KENJI
Executed: 2017-11-07
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium