Patent Assignment
Reel/Frame 044239/0879
Assignment of Assignor's Interest
Recorded: 2017-11-28
Pages: 5
Assignors
CHEN, WEIMING CHRIS
Executed: 2017-10-30
YEH, TING-YU
Executed: 2017-10-27
CHEN, CHIA-HSIN
Executed: 2017-10-30
YU, TU-HAO
Executed: 2017-10-27
TING, KUO-CHIANG
Executed: 2017-10-30
HOU, SHANG-YUN
Executed: 2017-10-30
WU, CHI-HSI
Executed: 2017-11-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Packaging with Subsrtates Connected by Conductive Bumps
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.