Patent Assignment
Reel/Frame 044242/0455
Assignment of Assignor's Interest
Recorded: 2017-11-29
Pages: 4
Assignors
LIAO, SIH-HAO
Executed: 2017-11-06
KUO, HUNG-JUI
Executed: 2017-11-06
HU, YU-HSIANG
Executed: 2017-11-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semicondcutor Device Package and Method of Forming Semicondcutor Device Package