Patent Assignment
Reel/Frame 044250/0113
Change of Name
Recorded: 2017-09-20
Pages: 8
Assignor
PT ESTABLISHMENT PREPARATION CO., LTD.
Executed: 2012-12-28
Assignee
POLYMATECH JAPAN CO., LTD.
16-1, HIRAKAWA-CHO 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Thermally Conductive Body and Method of Manufacturing the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 26, 2007
From: OHTA, MITSURU
To: POLYMATECH CO., LTD.
Reel/Frame 019483/0222 →
Corrective Assignment to Correct the Patent Office Error in the Spelling of the Receiving Party Address from: Nihonbash-Honcho; to: Nihonbashi-Honcho Previously Recorded on Reel 019483 Frame 0222. Assignor(S) Hereby Confirms the That This Information Is Accurate..
Aug 12, 2008
From: OHTA, MITSURU
To: POLYMATECH CO., LTD
Reel/Frame 021374/0943 →
Assignment of Assignor's Interest
Sep 20, 2017
From: POLYMA ASSET MANAGEMENT CO., LTD
To: POLYMATECH JAPAN CO., LTD.
Reel/Frame 043636/0622 →
Split and Joint Successor of the Business of Polymatech, Co., Ltd. Receiving All of the Assets Including Intellectual Property Namely Us Patent No. 7439475
Nov 29, 2017
From: POLYMATECH CO., LTD.
To: PT ESTABLISHMENT PREPARATION CO., LTD.
Reel/Frame 044580/0411 →
Split and Joint Successor of the Business of Polymatech, Co., Ltd. Receiving All of the Assets Including Intellectual Property Namely Us Patent No. 7439475
Nov 29, 2017
From: POLYMATECH CO., LTD.
To: POLYMA ASSET MANAGEMENT CO., LTD
Reel/Frame 045394/0028 →
Change of Name
Mar 13, 2019
From: POLYMATECH JAPAN CO., LTD.
To: SEKISUI POLYMATECH CO., LTD.
Reel/Frame 048586/0831 →