Patent Assignment
Reel/Frame 044251/0780
Assignment of Assignor's Interest
Recorded: 2017-11-29
Pages: 5
Assignors
ORI, YUKI
Executed: 2017-11-09
ARAI, HIDETA
Executed: 2017-11-09
MIKI, ATSUSHI
Executed: 2017-11-09
FUKUCHI, RYO
Executed: 2017-11-09
Assignee
JX NIPPON MINING & METALS CORPORATION
1-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN
Covered Property
(1)
Surface Treated Copper Foil, Copper Foil with Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.