Patent Assignment
Reel/Frame 044266/0519
Assignment of Assignor's Interest
Recorded: 2017-11-30
Pages: 3
Assignors
LYSACEK, DAVID
Executed: 2017-11-09
KRIZAKOVA, VIOLA
Executed: 2017-11-09
SIK, JAN
Executed: 2017-11-09
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL RD., MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Method of Forming a Multilayer Structure for Reducing Defects in Semiconductor Devices and Structure
Patent:
10,242,929 →
Application:
15/827,882 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →