Patent Assignment
Reel/Frame 044274/0810
Assignment of Assignor's Interest
Recorded: 2017-12-01
Pages: 5
Assignors
CHEN, RYAN CHIA-JEN
Executed: 2017-11-07
YIN, LI-WEI
Executed: 2017-11-07
PAN, TZU-WEN
Executed: 2017-11-07
CHEN, YI-CHUN
Executed: 2017-11-07
CHANG, CHENG-CHUNG
Executed: 2017-11-07
HSU, SHAO-HUA
Executed: 2017-11-07
LIN, YU-HSIEN
Executed: 2017-11-07
CHANG, MING-CHING
Executed: 2017-11-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure Cutting Process and Structures Formed Thereby