Patent Assignment
Reel/Frame 044277/0201
Assignment of Assignor's Interest
Recorded: 2017-12-01
Pages: 5
Assignors
BAEK, YONG HO
Executed: 2017-11-28
CHO, JUNG HYUN
Executed: 2017-11-28
KIM, MIN KEUN
Executed: 2017-11-28
HUR, YOUNG SIK
Executed: 2017-11-28
HAN, TAE HEE
Executed: 2017-11-28
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Sensor Package and Optical Fingerprint Sensor Module Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.