IP Library Assignment 044277/0346
Patent Assignment
Reel/Frame 044277/0346

Assignment of Assignor's Interest

Recorded: 2017-12-01 Pages: 4
Assignors
HWANG, JUN OH
Executed: 2017-11-29
SUNG, KI JUNG
Executed: 2017-11-29
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Application: 15/828,948 →
Publication: US 2019/0035758
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →