Patent Assignment
Reel/Frame 044278/0774
Assignment of Assignor's Interest
Recorded: 2017-10-16
Pages: 14
Assignors
MORIYA, YUSUKE
Executed: 2017-09-22
IWASAKI, MASANORI
Executed: 2017-09-27
OINOUE, TAKASHI
Executed: 2017-09-22
HAGIMOTO, YOSHIYA
Executed: 2017-10-04
MATSUGAI, HIROYASU
Executed: 2017-10-06
ITOU, HIROYUKI
Executed: 2017-10-12
SAITO, SUGURU
Executed: 2017-09-28
OHSHIMA, KEIJI
Executed: 2017-09-25
FUJII, NOBUTOSHI
Executed: 2017-09-22
TAZAWA, HIROSHI
Executed: 2017-09-27
SHIRAIWA, TOSHIAKI
Executed: 2017-09-25
ISHIDA, MINORU
Executed: 2017-09-28
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Lens Attached Substrate, Layered Lens Structure, Camera Module, Manufacturing Apparatus, and Manufacturing Method