Patent Assignment
Reel/Frame 044301/0683
Assignment of Assignor's Interest
Recorded: 2017-12-05
Pages: 3
Assignors
TENG, YA-CHUN
Executed: 2017-11-10
LIN, SUNG-YU
Executed: 2017-11-10
SUNG, CHIEN-MING
Executed: 2017-11-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Seal Ring for Bonded Dies