Patent Assignment
Reel/Frame 044309/0527
Assignment of Assignor's Interest
Recorded: 2017-10-27
Pages: 3
Assignor
VINCENT, MICHAEL B.
Executed: 2014-09-02
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE, AUSTIN, TEXAS, 78735
Covered Property
(1)
Fan-Out Wafer Level Packages Having Preformed Embedded Ground Plane Connections