Patent Assignment
Reel/Frame 044309/0920
Assignment of Assignor's Interest
Recorded: 2017-12-06
Pages: 3
Assignor
KAWABATA, KENICHI
Executed: 2017-11-09
Assignee
TDK CORPORATION
13-9-1, SHIBAURA, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Electronic Circuit Package Using Conductive Sealing Material