Patent Assignment
Reel/Frame 044314/0143
Assignment of Assignor's Interest
Recorded: 2017-10-30
Pages: 3
Assignor
OSHIGE, HIDEMASA
Executed: 2017-07-28
Assignee
CANON KABUSHIKI KAISHA
30-2, SHIMOMARUKO 3-CHOME, OHTA-KU, TOKYO, 146-8501, JAPAN
Covered Property
(1)
Semiconductor Device with Conductive Member in Tapered Through-Hole in Semiconductor Substrate and Method of Manufacturing Semiconductor Device