Patent Assignment
Reel/Frame 044315/0242
Assignment of Assignor's Interest
Recorded: 2017-12-06
Pages: 3
Assignor
YOSHIDA, TAKUJI
Executed: 2017-10-27
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU,, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device Manufacturing Method and Semiconductor Wafer