Patent Assignment
Reel/Frame 044321/0771
Assignment of Assignor's Interest
Recorded: 2017-12-06
Pages: 7
Assignors
KIM, OHHAN
Executed: 2017-12-04
YANG, DEOKKYUNG
Executed: 2017-12-04
LEE, HUNTEAK
Executed: 2017-12-04
YOON, INSANG
Executed: 2017-12-04
SHIM, IL KWON
Executed: 2017-12-06
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming a 3D Interposer System-In-Package Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.