Patent Assignment
Reel/Frame 044324/0867
Assignment of Assignor's Interest
Recorded: 2017-12-07
Pages: 5
Assignors
CHEN, SHUO-MAO
Executed: 2017-11-01
HSU, FENG-CHENG
Executed: 2017-11-07
HUANG, HAN-HSIANG
Executed: 2017-11-07
LIU, HSIEN-WEN
Executed: 2017-11-07
JENG, SHIN-PUU
Executed: 2017-11-01
LEE, HSIAO-WEN
Executed: 2017-11-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Chip Wafer Level Packages and Methods of Forming the Same