IP Library Assignment 044327/0087
Patent Assignment
Reel/Frame 044327/0087

Assignment of Assignor's Interest

Recorded: 2017-12-07 Pages: 5
Assignors
YOU, HEE-WOOK
Executed: 2017-09-18
LEE, WON-CHUL
Executed: 2017-11-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device and Semiconductor Package Including the Same
Application: 15/834,203 →
Publication: US 2018/0158827