Patent Assignment
Reel/Frame 044369/0652
Assignment of Assignor's Interest
Recorded: 2017-12-12
Pages: 5
Assignors
BEYNE, ERIC
Executed: 2017-11-30
DE VOS, JOERI
Executed: 2017-11-30
VAN HUYLENBROECK, STEFAAN
Executed: 2017-11-30
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method for Bonding and Interconnecting Integrated Circuit Devices