IP Library › Assignment 044391/0001
Patent Assignment
Reel/Frame 044391/0001

Assignment of Assignor's Interest

Recorded: 2017-12-13 Pages: 8
Assignors
YOO, CHAN H.
Executed: 2017-07-13
KAEDING, JOHN F.
Executed: 2017-07-13
PACHAMUTHU, ASHOK
Executed: 2017-07-13
TUTTLE, MARK E.
Executed: 2017-12-01
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property (1)
Thrumold Post Package with Reverse Build Up Hybrid Additive Structure
Application: 15/685,921 →
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 6 to Patent Security Agreement Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 044348/0253 →
Supplement No. 6 to Patent Security Agreement Nov 1, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 044653/0333 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0333 →
Release of Security Interest Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0838 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →