Patent Assignment
Reel/Frame 044403/0591
Assignment of Assignor's Interest
Recorded: 2017-12-15
Pages: 5
Assignee
SHINKAWA LTD.
51-1 INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Wire Bonding Apparatus and Wire Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.