IP Library Assignment 044407/0492
Patent Assignment
Reel/Frame 044407/0492

Assignment of Assignor's Interest

Recorded: 2017-12-15 Pages: 4
Assignors
FAN, CHUN HO
Executed: 2017-12-15
KUAH, TENG HOCK
Executed: 2017-12-14
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property (1)
Method for Manufacturing Wafer-Level Semiconductor Packages
Application: 15/815,986 →
Publication: US 2018/0151342
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 20, 2023
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 062444/0830 →