Patent Assignment
Reel/Frame 044411/0943
Assignment of Assignor's Interest
Recorded: 2017-12-15
Pages: 3
Assignors
YANG, CHAN-SYUN DAVID
Executed: 2017-11-28
LIN, LI-TE
Executed: 2017-11-28
LIN, YU-MING
Executed: 2017-11-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method and Equipment for Forming Gaps in a Material Layer