IP Library Assignment 044415/0069
Patent Assignment
Reel/Frame 044415/0069

Assignment of Assignor's Interest

Recorded: 2017-12-17 Pages: 8
Assignors
AGARWAL, RAHUL
Executed: 2017-12-15
BHAGAVAT, MILIND S.
Executed: 2017-12-15
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, PO BOX 3453, KEVIN A. O'NEIL, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Property (1)
Stacked Dies and Dummy Components for Improved Thermal Performance
Application: 15/844,575 →
Publication: US 2019/0189590
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 17, 2017
From: SRINIVASA SETTY, KAUSHIK MYSORE; WILKERSON, BRETT
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 044415/0089 →