IP Library Assignment 044417/0568
Patent Assignment
Reel/Frame 044417/0568

Assignment of Assignor's Interest

Recorded: 2017-12-18 Pages: 14
Assignors
BROADCOM CORPORATION
Executed: 2017-12-08
Assignee
BELL SEMICONDUCTOR, LLC
401 N. MICHIGAN AVE., SUITE 1600, CHICAGO, ILLINOIS, 60611
Covered Properties (2)
Tungsten Formation Process
Application: 08/141,780 →
Wire Bonding to Copper
Application: 09/236,406 →
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0001 →