IP Library › Assignment 059720/0001
Patent Assignment
Reel/Frame 059720/0001

Release of Security Interest

Recorded: 2022-04-15 Pages: 222
Assignor
Assignees
HILCO PATENT ACQUISITION 56, LLC
401 N. MICHIGAN AVE., SUITE 1630, CHICAGO, ILLINOIS, 60611
BELL SEMICONDUCTOR, LLC
401 N. MICHIGAN AVE., SUITE 1630, CHICAGO, ILLINOIS, 60611
BELL NORTHERN RESEARCH, LLC
401 N. MICHIGAN AVE., SUITE 1630, CHICAGO, ILLINOIS, 60611
Covered Properties (24)
Low Temperature Deposition of Silicon Oxides for Device Fabrication
Patent: 5,643,838 →
Application: 08/116,309 →
Tungsten Formation Process
Application: 08/141,780 →
Tungsten Formation Process
Patent: 6,323,126 →
Application: 08/329,806 →
Method of Forming Metal Layers Formed as a Composite of Sub-Layers Using Ti Texture Control Layer
Patent: 5,523,259 →
Application: 08/349,649 →
Method for Making a Metal to Metal Capacitor
Patent: 5,576,240 →
Application: 08/353,015 →
Novel Barrier Layer Treatments for Tungsten Plug
Patent: 5,599,739 →
Application: 08/366,867 →
Integrated Circuit Capacitor
Patent: 5,654,581 →
Application: 08/472,033 →
Method for Making a Capacitor
Patent: 5,851,870 →
Application: 08/644,086 →
Method of Integrated Circuit Fabrication Including a Step of Depositing Tungsten
Patent: 5,693,561 →
Application: 08/645,852 →
Flip Chip Bump Distribution on Die
Patent: 5,952,726 →
Application: 08/747,325 →
An Electronic Component for an Integrated Circuit
Patent: 5,825,073 →
Application: 08/863,713 →
Method for Distributing Connection Pads on a Semiconductor Die
Patent: 5,885,855 →
Application: 08/909,312 →
A Device and Method of Forming a Metal to Metal Capacitor Within an Integrated Circuit
Patent: 6,040,616 →
Application: 08/909,563 →
Heatspreader for a Flip Chip Device, and Method for Connecting the Heatspreader
Patent: 6,118,177 →
Application: 09/193,832 →
Deep Sub-Micron Metal Etch with in-Situ Hard Mask Etch
Patent: 6,194,323 →
Application: 09/212,228 →
Wire Bonding to Copper
Application: 09/236,406 →
High Density Plasma Passivation Layer and Method of Application
Patent: 6,153,543 →
Application: 09/370,422 →
Diffusion Barrier for Use with High Dielectric Constant Materials and Electronic Devices Incorporating Same
Patent: 6,340,827 →
Application: 09/478,647 →
Heatspreader for a Flip Chip Device, and Method for Connecting the Heatspreader
Patent: 6,681,482 →
Application: 09/496,989 →
Six-To-One Signal/Power Ratio Bump and Trace Pattern for Flip Chip Design
Patent: 6,591,410 →
Application: 09/752,626 →
Wire Bonding to Copper
Patent: 6,472,304 →
Application: 09/864,577 →
Publication: US 2001/0036716
Bonding Pad for Low K Dielectric
Patent: 6,798,035 →
Application: 10/600,255 →
Novel Barrier Process Using a Composite Structure for High-K Dielectric
Application: 60/115,783 →
Use of Novel Barriers for TA2O5 as Gate/Capacitor Applications
Application: 60/115,841 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Change of Name Jun 6, 2014
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 033102/0270 →
Assignment of Assignor's Interest Feb 20, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035058/0248 →
Assignment of Assignor's Interest Feb 20, 2015
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS GUARDIAN CORP.
Reel/Frame 035058/0646 →
Merger Feb 20, 2015
From: AT&T IPM CORP.
To: AT&T CORP.
Reel/Frame 035000/0041 →
Assignment of Assignor's Interest Feb 20, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035059/0001 →
Merger Feb 20, 2015
From: AGERE SYSTEMS INC.
To: AGERE SYSTEMS LLC
Reel/Frame 035058/0895 →
Merger Feb 20, 2015
From: AGERE SYSTEMS GUARDIAN CORP.
To: AGERE SYSTEMS INC.
Reel/Frame 035058/0884 →
Assignment of Assignor's Interest Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
Assignment of Assignor's Interest Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031) Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
Patent Security Agreement Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
Merger and Change of Name Nov 9, 2017
From: AGERE SYSTEMS GUARDIAN CORP.; AGERE SYSTEMS INC.
To: AGERE SYSTEMS INC.
Reel/Frame 044416/0779 →
Assignment of Assignor's Interest Nov 9, 2017
From: LUCENT TECHNOLOGIES, INC.
To: AGERE SYSTEMS GUARDIAN CORP.
Reel/Frame 044780/0092 →
Assignment of Assignor's Interest Nov 20, 2017
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS GUARDIAN CORP.
Reel/Frame 044484/0751 →
Assignment of Assignor's Interest Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044415/0144 →
Assignment of Assignor's Interest Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0001 →
Assignment of Assignor's Interest Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0766 →
Assignment of Assignor's Interest Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0608 →
Assignment of Assignor's Interest Dec 18, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044417/0568 →
Security Interest Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
Release of Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059723/0382 →
Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 060885/0001 →
Release of Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0719 →