IP Library › Assignment 044415/0144
Patent Assignment
Reel/Frame 044415/0144

Assignment of Assignor's Interest

Recorded: 2017-12-17 Pages: 14
Assignors
BROADCOM CORPORATION
Executed: 2017-12-08
Assignee
BELL SEMICONDUCTOR, LLC
401 N. MICHIGAN AVE., SUITE 1600, CHICAGO, ILLINOIS, 60611
Covered Properties (22)
Low Temperature Deposition of Silicon Oxides for Device Fabrication
Patent: 5,643,838 →
Application: 08/116,309 →
Tungsten Formation Process
Patent: 6,323,126 →
Application: 08/329,806 →
Method of Forming Metal Layers Formed as a Composite of Sub-Layers Using Ti Texture Control Layer
Patent: 5,523,259 →
Application: 08/349,649 →
Method for Making a Metal to Metal Capacitor
Patent: 5,576,240 →
Application: 08/353,015 →
Novel Barrier Layer Treatments for Tungsten Plug
Patent: 5,599,739 →
Application: 08/366,867 →
Integrated Circuit Capacitor
Patent: 5,654,581 →
Application: 08/472,033 →
Method for Making a Capacitor
Patent: 5,851,870 →
Application: 08/644,086 →
Method of Integrated Circuit Fabrication Including a Step of Depositing Tungsten
Patent: 5,693,561 →
Application: 08/645,852 →
Flip Chip Bump Distribution on Die
Patent: 5,952,726 →
Application: 08/747,325 →
An Electronic Component for an Integrated Circuit
Patent: 5,825,073 →
Application: 08/863,713 →
Method for Distributing Connection Pads on a Semiconductor Die
Patent: 5,885,855 →
Application: 08/909,312 →
A Device and Method of Forming a Metal to Metal Capacitor Within an Integrated Circuit
Patent: 6,040,616 →
Application: 08/909,563 →
Heatspreader for a Flip Chip Device, and Method for Connecting the Heatspreader
Patent: 6,118,177 →
Application: 09/193,832 →
Deep Sub-Micron Metal Etch with in-Situ Hard Mask Etch
Patent: 6,194,323 →
Application: 09/212,228 →
High Density Plasma Passivation Layer and Method of Application
Patent: 6,153,543 →
Application: 09/370,422 →
Diffusion Barrier for Use with High Dielectric Constant Materials and Electronic Devices Incorporating Same
Patent: 6,340,827 →
Application: 09/478,647 →
Heatspreader for a Flip Chip Device, and Method for Connecting the Heatspreader
Patent: 6,681,482 →
Application: 09/496,989 →
Six-To-One Signal/Power Ratio Bump and Trace Pattern for Flip Chip Design
Patent: 6,591,410 →
Application: 09/752,626 →
Wire Bonding to Copper
Patent: 6,472,304 →
Application: 09/864,577 →
Publication: US 2001/0036716
Bonding Pad for Low K Dielectric
Patent: 6,798,035 →
Application: 10/600,255 →
Novel Barrier Process Using a Composite Structure for High-K Dielectric
Application: 60/115,783 →
Use of Novel Barriers for TA2O5 as Gate/Capacitor Applications
Application: 60/115,841 →
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Change of Name Jun 6, 2014
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 033102/0270 →
Assignment of Assignor's Interest Feb 20, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035058/0248 →
Assignment of Assignor's Interest Feb 20, 2015
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS GUARDIAN CORP.
Reel/Frame 035058/0646 →
Merger Feb 20, 2015
From: AT&T IPM CORP.
To: AT&T CORP.
Reel/Frame 035000/0041 →
Assignment of Assignor's Interest Feb 20, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035059/0001 →
Merger Feb 20, 2015
From: AGERE SYSTEMS INC.
To: AGERE SYSTEMS LLC
Reel/Frame 035058/0895 →
Merger Feb 20, 2015
From: AGERE SYSTEMS GUARDIAN CORP.
To: AGERE SYSTEMS INC.
Reel/Frame 035058/0884 →
Assignment of Assignor's Interest Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
Assignment of Assignor's Interest Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031) Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
Patent Security Agreement Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
Assignment of Assignor's Interest Nov 9, 2017
From: LUCENT TECHNOLOGIES, INC.
To: AGERE SYSTEMS GUARDIAN CORP.
Reel/Frame 044780/0092 →
Merger and Change of Name Nov 9, 2017
From: AGERE SYSTEMS GUARDIAN CORP.; AGERE SYSTEMS INC.
To: AGERE SYSTEMS INC.
Reel/Frame 044416/0779 →
Assignment of Assignor's Interest Nov 20, 2017
From: LUCENT TECHNOLOGIES INC.
To: AGERE SYSTEMS GUARDIAN CORP.
Reel/Frame 044484/0751 →
Assignment of Assignor's Interest Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0001 →
Assignment of Assignor's Interest Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0766 →
Assignment of Assignor's Interest Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0608 →
Security Interest Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
Release of Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0001 →
Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 060885/0001 →
Release of Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059723/0382 →
Release of Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0719 →