Patent Assignment
Reel/Frame 044421/0557
Assignment of Assignor's Interest
Recorded: 2017-12-18
Pages: 3
Assignors
ARAI, HIDETA
Executed: 2017-12-13
FUKUCHI, RYO
Executed: 2017-12-13
MIKI, ATSUSHI
Executed: 2017-12-13
Assignee
JX NIPPON MINING & METALS CORPORATION
1-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN
Covered Property
(1)
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.