Patent Assignment
Reel/Frame 044424/0007
Assignment of Assignor's Interest
Recorded: 2017-12-18
Pages: 7
Assignors
KIM, TAE-YEONG
Executed: 2017-11-01
KANG, PIL-KYU
Executed: 2017-11-01
KIM, SEOK-HO
Executed: 2017-11-01
MOON, KWANG-JIN
Executed: 2017-11-01
LEE, NA-EIN
Executed: 2017-11-01
LEE, HO-JIN
Executed: 2017-11-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Bonding Apparatus and Wafer Bonding System Including the Same