Patent Assignment
Reel/Frame 044427/0306
Assignment of Assignor's Interest
Recorded: 2017-12-19
Pages: 4
Assignors
KUO, HUNG-JUI
Executed: 2017-11-24
HU, YU-HSIANG
Executed: 2017-11-24
LIAO, SIH-HAO
Executed: 2017-11-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package and Method of Fabricating an Integrated Fan-Out Package