IP Library › Assignment 044443/0397
Patent Assignment
Reel/Frame 044443/0397

Assignment of Assignor's Interest

Recorded: 2017-12-20 Pages: 3
Assignors
KOBUKE, HISASHI
Executed: 2017-11-29
NINOMIYA, EMI
Executed: 2017-11-20
Assignee
EPCOS AG
ST.-MARTIN-STR. 53, MUNICH, 81669, GERMANY
Covered Property (1)
Multilayer Interconnection Substrate for High Frequency and Manufacturing Method Thereof
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 27, 2017
From: EPCOS AG
To: SNAPTRACK, INC.
Reel/Frame 044920/0356 →
Assignment of Assignor's Interest Jan 4, 2018
From: EPCOS AG
To: SNAPTRACK, INC.
Reel/Frame 045002/0188 →
Assignment of Assignor's Interest Nov 20, 2018
From: TDK CORPORATION; TDK ELECTRONICS AG
To: SNAPTRACK, INC.
Reel/Frame 047553/0476 →