Patent Assignment
Reel/Frame 044444/0092
Assignment of Assignor's Interest
Recorded: 2017-12-20
Pages: 3
Assignee
JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.
10-8, DOGENZAKA 1-CHOME, SHIBUYA-KU, TOKYO, 150-0043, JAPAN
Covered Property
(1)
Lead Bonding Structure